Integrated Assemblies Having Charge-Trapping Material Arranged in Vertically-Spaced Segments, and Methods of Forming Integrated Assemblies

ABSTRACT

Some embodiments include a memory array having a vertical stack of alternating insulative levels and wordline levels. The wordline levels have conductive terminal ends within control gate regions. The control gate regions are vertically spaced from one another by first insulative regions which include first insulative material. Charge-storage material is laterally outward of the conductive terminal ends, and is configured as segments. The segments of the charge-storage material are arranged one atop another and are vertically spaced from one another by second insulative regions which include second insulative material. The second insulative material has a different dielectric constant than the first insulative material. Charge-tunneling material extends vertically along the stack, and is adjacent to the segments of the charge-trapping material. Channel material extends vertically along the stack, and is adjacent to the charge-tunneling material. Some embodiments include methods of forming integrated assemblies.

TECHNICAL FIELD

Integrated assemblies having charge-trapping material arranged invertically-spaced segments, and methods of forming integratedassemblies.

BACKGROUND

Memory provides data storage for electronic systems. Flash memory is onetype of memory, and has numerous uses in modern computers and devices.For instance, modern personal computers may have BIOS stored on a flashmemory chip. As another example, it is becoming increasingly common forcomputers and other devices to utilize flash memory in solid statedrives to replace conventional hard drives. As yet another example,flash memory is popular in wireless electronic devices because itenables manufacturers to support new communication protocols as theybecome standardized, and to provide the ability to remotely upgrade thedevices for enhanced features.

NAND may be a basic architecture of flash memory, and may be configuredto comprise vertically-stacked memory cells.

Before describing NAND specifically, it may be helpful to more generallydescribe the relationship of a memory array within an integratedarrangement. FIG. 1 shows a block diagram of a prior art device 1000which includes a memory array 1002 having a plurality of memory cells1003 arranged in rows and columns along with access lines 1004 (e.g.,wordlines to conduct signals WL0 through WLm) and first data lines 1006(e.g., bitlines to conduct signals BL0 through BLn). Access lines 1004and first data lines 1006 may be used to transfer information to andfrom the memory cells 1003. A row decoder 1007 and a column decoder 1008decode address signals AO through AX on address lines 1009 to determinewhich ones of the memory cells 1003 are to be accessed. A senseamplifier circuit 1015 operates to determine the values of informationread from the memory cells 1003. An I/O circuit 1017 transfers values ofinformation between the memory array 1002 and input/output (I/O) lines1005. Signals DQ0 through DQN on the I/O lines 1005 can represent valuesof information read from or to be written into the memory cells 1003.Other devices can communicate with the device 1000 through the I/O lines1005, the address lines 1009, or the control lines 1020. A memorycontrol unit 1018 is used to control memory operations to be performedon the memory cells 1003, and utilizes signals on the control lines1020. The device 1000 can receive supply voltage signals Vcc and Vss ona first supply line 1030 and a second supply line 1032, respectively.The device 1000 includes a select circuit 1040 and an input/output (I/O)circuit 1017. The select circuit 1040 can respond, via the I/O circuit1017, to signals CSEL1 through CSELn to select signals on the first datalines 1006 and the second data lines 1013 that can represent the valuesof information to be read from or to be programmed into the memory cells1003. The column decoder 1008 can selectively activate the CSEL1 throughCSELn signals based on the AO through AX address signals on the addresslines 1009. The select circuit 1040 can select the signals on the firstdata lines 1006 and the second data lines 1013 to provide communicationbetween the memory array 1002 and the I/O circuit 1017 during read andprogramming operations.

The memory array 1002 of FIG. 1 may be a NAND memory array, and FIG. 2shows a block diagram of a three-dimensional NAND memory device 200which may be utilized for the memory array 1002 of FIG. 1 . The device200 comprises a plurality of strings of charge-storage devices. In afirst direction (Z-Z′), each string of charge-storage devices maycomprise, for example, thirty-two charge-storage devices stacked overone another with each charge-storage device corresponding to one of, forexample, thirty-two tiers (e.g., Tier0-Tier31). The charge-storagedevices of a respective string may share a common channel region, suchas one formed in a respective pillar of semiconductor material (e.g.,polysilicon) about which the string of charge-storage devices is formed.In a second direction (X-X′), each first group of, for example, sixteenfirst groups of the plurality of strings may comprise, for example,eight strings sharing a plurality (e.g., thirty-two) of access lines(i.e., “global control gate (CG) lines”, also known as wordlines, WLs).Each of the access lines may couple the charge-storage devices within atier. The charge-storage devices coupled by the same access line (andthus corresponding to the same tier) may be logically grouped into, forexample, two pages, such as P0/P32, P1/P33, P2/P34 and so on, when eachcharge-storage device comprises a cell capable of storing two bits ofinformation. In a third direction (Y-Y′), each second group of, forexample, eight second groups of the plurality of strings, may comprisesixteen strings coupled by a corresponding one of eight data lines. Thesize of a memory block may comprise 1,024 pages and total about 16 MB(e.g., 16 WLs×32 tiers×2 bits=1,024 pages/block, block size=1,024pages×16 KB/page=16 MB). The number of the strings, tiers, access lines,data lines, first groups, second groups and/or pages may be greater orsmaller than those shown in FIG. 2 .

FIG. 3 shows a cross-sectional view of a memory block 300 of the 3D NANDmemory device 200 of FIG. 2 in an X-X′ direction, including fifteenstrings of charge-storage devices in one of the sixteen first groups ofstrings described with respect to FIG. 2 . The plurality of strings ofthe memory block 300 may be grouped into a plurality of subsets 310,320, 330 (e.g., tile columns), such as tile column_(I), tile column_(j)and tile column_(K), with each subset (e.g., tile column) comprising a“partial block” of the memory block 300. A global drain-side select gate(SGD) line 340 may be coupled to the SGDs of the plurality of strings.For example, the global SGD line 340 may be coupled to a plurality(e.g., three) of sub-SGD lines 342, 344, 346 with each sub-SGD linecorresponding to a respective subset (e.g., tile column), via acorresponding one of a plurality (e.g., three) of sub-SGD drivers 332,334, 336. Each of the sub-SGD drivers 332, 334, 336 may concurrentlycouple or cut off the SGDs of the strings of a corresponding partialblock (e.g., tile column) independently of those of other partialblocks. A global source-side select gate (SGS) line 360 may be coupledto the SGSs of the plurality of strings. For example, the global SGSline 360 may be coupled to a plurality of sub-SGS lines 362, 364, 366with each sub-SGS line corresponding to the respective subset (e.g.,tile column), via a corresponding one of a plurality of sub-SGS drivers322, 324, 326. Each of the sub-SGS drivers 322, 324, 326 mayconcurrently couple or cut off the SGSs of the strings of acorresponding partial block (e.g., tile column) independently of thoseof other partial blocks. A global access line (e.g., a global CG line)350 may couple the charge-storage devices corresponding to therespective tier of each of the plurality of strings. Each global CG line(e.g., the global CG line 350) may be coupled to a plurality ofsub-access lines (e.g., sub-CG lines) 352, 354, 356 via a correspondingone of a plurality of sub-string drivers 312, 314 and 316. Each of thesub-string drivers may concurrently couple or cut off the charge-storagedevices corresponding to the respective partial block and/or tierindependently of those of other partial blocks and/or other tiers. Thecharge-storage devices corresponding to the respective subset (e.g.,partial block) and the respective tier may comprise a “partial tier”(e.g., a single “tile”) of charge-storage devices. The stringscorresponding to the respective subset (e.g., partial block) may becoupled to a corresponding one of sub-sources 372, 374 and 376 (e.g.,“tile source”) with each sub-source being coupled to a respective powersource.

The NAND memory device 200 is alternatively described with reference toa schematic illustration of FIG. 4 .

The memory array 200 includes wordlines 202 ₁ to 202 _(N), and bitlines228 ₁ to 228 _(M).

The memory array 200 also includes NAND strings 206 ₁ to 206 _(M). EachNAND string includes charge-storage transistors 208 ₁ to 208 _(N). Thecharge-storage transistors may use floating gate material (e.g.,polysilicon) to store charge, or may use charge-trapping material (suchas, for example, silicon nitride, metallic nanodots, etc.) to storecharge.

The charge-storage transistors 208 are located at intersections ofwordlines 202 and strings 206. The charge-storage transistors 208represent non-volatile memory cells for storage of data. Thecharge-storage transistors 208 of each NAND string 206 are connected inseries source-to-drain between a source-select device (e.g., source-sideselect gate, SGS) 210 and a drain-select device (e.g., drain-side selectgate, SGD) 212. Each source-select device 210 is located at anintersection of a string 206 and a source-select line 214, while eachdrain-select device 212 is located at an intersection of a string 206and a drain-select line 215. The select devices 210 and 212 may be anysuitable access devices, and are generically illustrated with boxes inFIG. 4 .

A source of each source-select device 210 is connected to a commonsource line 216. The drain of each source-select device 210 is connectedto the source of the first charge-storage transistor 208 of thecorresponding NAND string 206. For example, the drain of source-selectdevice 210 ₁ is connected to the source of charge-storage transistor 208₁ of the corresponding NAND string 206 ₁. The source-select devices 210are connected to source-select line 214.

The drain of each drain-select device 212 is connected to a bitline(i.e., digit line) 228 at a drain contact. For example, the drain ofdrain-select device 212 ₁ is connected to the bitline 228 ₁. The sourceof each drain-select device 212 is connected to the drain of the lastcharge-storage transistor 208 of the corresponding NAND string 206. Forexample, the source of drain-select device 212 ₁ is connected to thedrain of charge-storage transistor 208 _(N) of the corresponding NANDstring 206 ₁.

The charge-storage transistors 208 include a source 230, a drain 232, acharge-storage region 234, and a control gate 236. The charge-storagetransistors 208 have their control gates 236 coupled to a wordline 202.A column of the charge-storage transistors 208 are those transistorswithin a NAND string 206 coupled to a given bitline 228. A row of thecharge-storage transistors 208 are those transistors commonly coupled toa given wordline 202.

It is desired to develop improved NAND architecture and improved methodsfor fabricating NAND architecture.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a block diagram of a prior art memory device having amemory array with memory cells.

FIG. 2 shows a schematic diagram of the prior art memory array of FIG. 1in the form of a 3D NAND memory device.

FIG. 3 shows a cross-sectional view of the prior art 3D NAND memorydevice of FIG. 2 in an X-X′ direction.

FIG. 4 is a schematic diagram of a prior art NAND memory array.

FIG. 5 is a diagrammatic cross-sectional side view of a region of anintegrated assembly at an example process stage of an example method forforming an example memory array.

FIG. 6 is a diagrammatic cross-sectional side view of the region of theintegrated assembly of FIG. 5 shown at an example process stagefollowing that of FIG. 5 .

FIG. 6A is a diagrammatic top view of a portion of the integratedassembly of FIG. 6 .

FIGS. 7-16 are diagrammatic cross-sectional side views of the region ofthe integrated assembly of FIG. 5 shown at example sequential processstages following the process stage of FIG. 6 .

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Operation of NAND memory cells comprises movement of charge between achannel material and a charge-storage material. For instance,programming of a NAND memory cell may comprise moving charge (i.e.,electrons) from the channel material into the charge-storage material,and then storing the charge within the charge-storage material. Erasingof the NAND memory cell may comprise moving holes into thecharge-storage material to recombine with the electrons stored in thecharge-storage material, and to thereby release charge from thecharge-storage material. The charge-storage material may comprisecharge-trapping material (for instance, silicon nitride, metal dots,etc.). A problem with conventional NAND can be that charge-trappingmaterial extends across multiple memory cells of a memory array, and canenable charge migration between the cells. The charge migration betweenmemory cells may lead to data retention problems. Some embodimentsinclude NAND architectures having breaks in the charge-trapping materialin regions between memory cells; and such breaks may impede migration ofcharge between memory cells. The charge-trapping material of such NANDarchitectures may be configured as vertically-spaced segments. In someembodiments, low-k dielectric material (i.e., dielectric material havinga dielectric constant of less than about 3.9) may be provided betweenthe vertically-spaced segments of the charge-trapping material.

Referring to FIG. 5 , a construction (i.e., assembly, architecture,etc.) 10 includes a stack 12 of alternating first and second levels 14and 16. The first levels 14 comprise first material 18, and the secondlevels 16 comprise second material 20. The first material 18 may beinsulative material (e.g., silicon dioxide), and the second material 20may be utilized as a sacrificial material; and in some embodiments maycomprise, consist essentially of, or consist of silicon nitride. In someembodiments, the materials 18 and 20 may be referred to as a firstmaterial and an additional material, respectively.

The levels 14 and 16 may be of any suitable thicknesses; and may be thesame thickness as one another, or different thicknesses relative to oneanother. In some embodiments, the levels 14 and 16 may have verticalthicknesses within a range of from about 10 nanometers (nm) to about 400nm. In some embodiments, the second levels 16 may be thicker than thefirst levels 14. For instance, in some embodiments the second levels 16may have thicknesses within a range of from about 20 nm to about 40 nm,and the first levels 14 may have thicknesses within a range of fromabout 15 nm to about 30 nm.

Some of the sacrificial material 20 of the second levels 16 isultimately replaced with conductive material of memory cell gates.Accordingly, the levels 16 may ultimately correspond to memory celllevels (also referred to herein as wordline levels) of a NANDconfiguration. The NAND configuration will include strings of memorycells (i.e., NAND strings), with the number of memory cells in thestrings being determined by the number of vertically-stacked levels 16.The NAND strings may comprise any suitable number of memory cell levels.For instance, the NAND strings may have 8 memory cell levels, 16 andmemory cell levels, 32 memory cell levels, 64 memory cell levels, 512memory cell levels, 1024 memory cell levels, etc. The vertical stack 12is shown to extend upwardly beyond the illustrated region of the stackto indicate that there may be more vertically-stacked levels than thosespecifically illustrated in the diagram of FIG. 5 .

The stack 12 is shown to be supported over a base 22. The base 22 maycomprise semiconductor material; and may, for example, comprise, consistessentially of, or consist of monocrystalline silicon. The base 22 maybe referred to as a semiconductor substrate. The term “semiconductorsubstrate” means any construction comprising semiconductive material,including, but not limited to, bulk semiconductive materials such as asemiconductive wafer (either alone or in assemblies comprising othermaterials), and semiconductive material layers (either alone or inassemblies comprising other materials). The term “substrate” refers toany supporting structure, including, but not limited to, thesemiconductor substrates described above. In some applications, the base22 may correspond to a semiconductor substrate containing one or morematerials associated with integrated circuit fabrication. Such materialsmay include, for example, one or more of refractory metal materials,barrier materials, diffusion materials, insulator materials, etc.

A gap is provided between the stack 12 and the base 22 to indicate thatother components and materials may be provided between the stack 12 andthe base 22. Such other components and materials may comprise additionallevels of the stack, a source line level, source-side select gates(SGSs), etc.

Referring to FIG. 6 , an opening 24 is formed through the stack 12, withsuch opening extending through the first and second levels 14 and 16.The opening is ultimately utilized for fabricating channel materialpillars associated with vertically-stacked memory cells of a memoryarray, and in some embodiments may be referred to as a pillar opening.The opening 24 may have any suitable configuration when viewed fromabove; and in some example embodiments may be circular, elliptical,polygonal, etc. FIG. 6A shows a top view of a portion of the top level14 of the illustrated region of construction 10, and illustrates anexample configuration in which the opening 24 is circular-shaped whenviewed from above. The opening may be representative of a large numberof substantially identical openings formed through the stack 12 duringfabrication of a memory array (with the term “substantially identical”meaning identical to within reasonable tolerances of fabrication andmeasurement).

The materials 18 and 20 have surfaces 19 and 21, respectively, which areexposed along sidewalls of the opening 24.

Referring to FIG. 7 , a material 26 is formed within the opening 24 andalong the second levels 16 selectively relative to the first levels 14(i.e., along the surfaces 21 of the material 20 selectively relative tothe surfaces 19 of the material 18). The material 26 is configured assegments 28, with such segments being vertically spaced from one anotherby recesses 30. The material 26 may comprise any suitablecomposition(s); and in some embodiments may comprise, consistessentially of, or consist of silicon nitride or polycrystallinesemiconductor material (e.g., polycrystalline silicon). Thepolycrystalline silicon of the material 26 may be in either a dopedconfiguration or in an undoped configuration (generally corresponding toan intrinsically-doped configuration). In some embodiments, some or allof the material 26 is later removed, and thus some or all of thematerial 26 is sacrificial material.

The material 26 may be selectively formed along the first levels 16relative to the second levels 14 utilizing any suitable processing. Insome embodiments, a hindering material (also referred to herein as apoisoning material) may be selectively formed along the first material18 relative to the second material 20 to preclude subsequent formationof the material 26 along surfaces of the first material 18, and then thematerial 26 may be formed by a suitable deposition process (e.g., atomiclayer deposition, chemical vapor deposition, etc.). The hinderingmaterial may comprise any suitable composition(s); and in someembodiments may comprise one or more of N,Ndimethylaminotrimethylsilane, bis(N,N-dimethylamino)dimethylsilane,ethylenediamine, 1-trimethylsilylpyrrolidine, 1-trimethylsilylpyrrole,3,5-dimethyl-1-trimethylsilyl, and R1-(C—OH)—R2; where R1 and R2 areorganic moieties.

In some embodiments, a cleaning step is utilized to treat surfaces ofthe insulative material 18 (e.g., silicon dioxide) prior to providingthe hindering material (not shown) and forming the material 26. Thecleaning step may utilize, for example, ammonium fluoride. The cleaningstep may recess the exposed surfaces 19 of the first insulative material18, as shown.

The insulative material 18 may be considered to be exposed along innerlateral surfaces of the recesses 30; with such inner lateral surfaces ofthe recesses 30 corresponding to the exposed surfaces 19.

The material 26 may be formed to any suitable thickness; and in someembodiments may be formed to a thickness within a range of from about 5nanometers (nm) to about 20 nm; such as, for example, a thickness withina range of from about 8 nm to about 10 nm.

Referring to FIG. 8 , insulative material 32 is formed within theopening 24, along the material 26, and within the recesses 30. In someembodiments, one of the insulative materials 18 and 32 may be referredto as a first insulative material while the other is referred to as asecond insulative material so that the materials 18 and 32 may bedistinguished relative to one another. The utilization of the terms“first” and “second” is arbitrary. In some embodiments, the material 18is referred to as the first insulative material while the material 32 isreferred to as the second insulative material, and in other embodimentsthe material 32 is referred to as the first insulative material whilethe material 18 is referred to as the second insulative material.

The insulative material 32 directly contacts the insulative material 18along the inner lateral surfaces 19 of the recesses 30.

The insulative material 32 may comprise any suitable composition(s). Insome embodiments, the insulative material 32 may comprise a samecomposition as the insulative material 18 (e.g., both may comprise,consist essentially of, or consist of silicon dioxide). In otherembodiments, the insulative material 32 may comprise a differentcomposition than the insulative material 18. For instance, theinsulative material 32 may have a different dielectric constant than theinsulative material 18. In some embodiments, the insulative material 32comprises a higher dielectric constant than the insulative material 18.In such embodiments, the insulative material 32 may comprise one or moreof aluminum oxide, zirconium oxide and hafnium oxide, while theinsulative material 18 comprises, consists essentially of, or consistsof silicon dioxide. In some embodiments, the insulative material 32comprises a lower dielectric constant than the insulative material 18.In such embodiments, the insulative materials 18 and 32 may bothcomprise silicon dioxide; but the silicon dioxide of the material 32 maybe more porous than that of the material 18 (i.e., of lower density thanthe silicon dioxide of material 18), and/or may comprise one or more ofcarbon, nitrogen and boron (e.g., may correspond to carbon-doped silicondioxide). In some embodiments, the material 18 may comprise silicondioxide having a dielectric constant of about 3.9, and the material 32may comprise a silicon-dioxide-containing composition having adielectric constant of less than 3.9.

Referring to FIG. 9 , the insulative material 32 is removed from alongthe material 26, while leaving the insulative material 32 within therecesses 30. The insulative material 32 remaining at the process stageof FIG. 9 is configured as segments 34. The segments 34 are verticallyspaced from one another by intervening regions 36.

In some embodiments, the segments 28 and 34 may be referred to as firstand second segments, respectively, to distinguish such segments from oneanother.

Referring to FIG. 10 , the material 26 (FIG. 9 ) is removed to formrecesses 38 within the intervening regions 36. In some embodiments, therecesses 38 may be referred to as second recesses to distinguish themfrom the first recesses 30 which were described above with reference toFIG. 7 .

In the illustrated embodiment, an entirety of the material 26 (FIG. 9 )is removed to expose the surfaces 21 of the material 20 within thecavities 38. In other embodiments, only a portion of the material 26(FIG. 9 ) may be removed to form the cavities 38. In yet otherembodiments, an entirety of the material 26 (FIG. 9 ) may be removed,and some of the material 20 may also be removed to form the cavities 38.

Referring to FIG. 11 , charge-blocking material 40 is formed to extendvertically along the first and second levels 14 and 16. Thecharge-blocking material extends within the recesses 38, and lines therecesses 38. In the illustrated embodiment, the charge-blocking material40 is along an undulating vertical path which extends conformally alongthe segments 34 and within the recesses 38.

The charge-blocking material 40 may comprise any suitablecomposition(s); and in some embodiments may comprise, consistessentially of, or consist of silicon dioxide and/or one or more high-kmaterials (e.g., aluminum oxide, zirconium oxide, hafnium oxide, etc.);with the term “high-k” meaning a dielectric constant greater than thatof silicon dioxide.

Referring to FIG. 12 , charge-storage material 42 is formed to extendalong the segments 34 and within the lined recesses 38.

The charge-storage material 42 may comprise any suitable composition(s).In some embodiments, the charge-storage material 42 may comprisecharge-trapping materials, such as silicon nitride, silicon oxynitride,conductive nanodots, etc. For instance, in some embodiments thecharge-storage material 42 may comprise, consist essentially of, orconsist of silicon nitride. In alternative embodiments, thecharge-storage material 42 may be configured to include floating gatematerial (such as, for example, polycrystalline silicon).

Referring to FIG. 13 , the charge-storage material 42 is removed fromover the segments 34, while leaving the charge-storage material 42within the recesses 38. The opening 24 has substantially vertical,planar sidewalls 41 at the processing stage of FIG. 13 , with suchsidewalls 41 extending along surfaces of the charge-storage material 42and the charge-blocking material 40 (i.e., extending vertically alongthe first and second levels 14 and 16).

Referring to FIG. 14 , tunneling material (gate dielectric material,charge-tunneling material) 44 is formed along the vertical surfaces 41,and channel material 46 is formed along the tunneling material.

The tunneling material 44 may comprise any suitable composition(s). Insome embodiments, the tunneling material 44 may comprise, for example,one or more of silicon dioxide, aluminum oxide, hafnium oxide, zirconiumoxide, etc.

The channel material 46 comprises semiconductor material; and maycomprise any suitable composition or combination of compositions. Forinstance, the channel material 46 may comprise one or more of silicon,germanium, III/V semiconductor materials (e.g., gallium phosphide),semiconductor oxides, etc.; with the term III/V semiconductor materialreferring to semiconductor materials comprising elements selected fromgroups III and V of the periodic table (with groups III and V being oldnomenclature, and now being referred to as groups 13 and 15). In someembodiments, the channel material 46 may comprise, consist essentiallyof, or consist of silicon.

In the illustrated embodiment, the channel material 46 only partiallyfills a central region of the opening 24, and insulative material 48fills a remaining interior region of the opening 24. The insulativematerial 48 may comprise any suitable composition or combination ofcompositions, such as, for example, silicon dioxide. The illustratedconfiguration of the channel material may be considered to comprise ahollow channel configuration, in that the insulative material 48 isprovided within a “hollow” in the annular ring-shaped channelconfiguration. In other embodiments (not shown), the channel materialmay be configured as a solid pillar configuration.

Notably, the channel material 46 is “flat” (i.e., is substantiallyvertically of continuous thickness, and is substantially verticallystraight), as opposed to being undulating. The flat channel material maypositively impact string current as compared to non-flat configurationsof some conventional designs. In some embodiments, the configuration ofthe channel material 46 of FIG. 14 may be referred to as a “flatconfiguration”.

Referring to FIG. 15 , the material 20 (FIG. 14 ) is removed to leavevoids 50 along the second levels 16. Such removal may be accomplishedwith any suitable etch which is selective for the material 20 relativeto the materials 18 and 40. For purposes of interpreting this disclosureand the claims that follow, an etch is selective for a second materialrelative to a first material if the etch removes the second materialfaster than the first material, which can include, but is not limitedto, etches 100% selective for the second material relative to the firstmaterial. In a processing step which is not shown, slits may be formedthrough stack 12 (FIG. 14 ) to provide access to the first and secondlevels 14/16. Etchant may be flowed into such slits to remove the secondmaterial 20.

Referring to FIG. 16 , the voids 50 (FIG. 15 ) are lined withdielectric-barrier material 52, and then conductive material 54 isformed within the voids.

The dielectric-barrier material 52 may comprise any suitablecomposition(s). In some embodiments, the dielectric-barrier material 52may comprise high-k material (for instance, one or more of aluminumoxide, hafnium oxide, zirconium oxide, tantalum oxide, etc.). In someembodiments, the dielectric-barrier material 52 may comprise, consistessentially of, or consist of aluminum oxide.

The conductive material 54 is shown comprising an outer region 56, andan inner region (or core region) 58. The outer region 56 comprises afirst material 60, and the inner region 58 comprises a second material62. The materials 60 and 62 may comprise any suitable electricallyconductive composition(s); such as, for example, one or more of variousmetals (e.g., titanium, tungsten, cobalt, nickel, platinum, ruthenium,etc.), metal-containing compositions (e.g., metal silicide, metalnitride, metal carbide, etc.), and/or conductively-doped semiconductormaterials (e.g., conductively-doped silicon, conductively-dopedgermanium, etc.). In some embodiments, the material 60 may comprise oneor more metal nitrides; and may, for example, comprise, consistessentially of, or consist of the titanium nitride. In some embodiments,the material 62 may comprise, consist essentially of, or consist oftungsten.

The wordline levels 16 comprise the conductive material 54, and in someembodiments such conductive material may be referred to as conductivewordline material.

The insulative levels 14 comprise the insulative materials 18 and 32.

The insulative levels 14 alternate with the wordline levels 16 withinthe vertical stack 12 of FIG. 16 .

The conductive wordline material 54 comprises terminal ends 55, and theinsulative levels 14 comprise terminal ends 57 along edges of theinsulative material 32. In some embodiments the terminal ends 55 and 57may be referred to as first and second terminal ends, respectively. Inthe illustrated embodiment, the first terminal ends 55 are laterallyinset relative to the second terminal ends 57 such that the gaps 38 maybe considered to be along the first terminal ends 55 and verticallybetween the second terminal ends 57.

The wordline levels 16 comprise gates (also referred to herein as gateregions, and as control gate regions) 64 along the terminal ends 55. Insome embodiments, the control gate regions 64 may be considered toinclude the conductive terminal ends 55 (i.e., the terminal ends 55 maybe considered to be within the control gate regions 64). The gates 64are incorporated into memory cells (e.g., NAND memory cells) 66. Suchmemory cells may be incorporated into a three-dimensional NAND memoryarray 70 analogous to the NAND memory arrays described above withreference to FIGS. 1-4 . The memory cells 66 within the array 70 may beall substantially identical to one another.

The wordline levels 16 comprise conductive wordlines (also referred toherein as wordline regions) 68 proximate the gates 64.

The gates 64 are vertically-spaced from one another by insulativeregions 72 comprising the insulative material 18 of the insulativelevels 14. Similarly, the wordlines 68 are vertically spaced from oneanother by intervening regions 74 comprising the insulative material 18of the insulative levels 14.

The insulative levels 18 comprise the insulative material 32 within thesecond terminal end 57, and comprise the insulative material 18proximate the second terminal ends 57 and within the intervening regions72 and 74. In some embodiments, the insulative material 32 may beconsidered to comprise segments 34 which are vertically between segments28 of the charge-storage material 42. The segments 28 may be consideredto be arranged one atop another, and to be vertically spaced from oneanother by the intervening segments 34 of the insulative material 32.

As noted above, in some embodiments the insulative material 18 maycomprise a different dielectric constant than the insulative material32. In some embodiments, it may be advantageous for the insulativematerial 32 to comprise low-k dielectric material (i.e., dielectricmaterial having a dielectric constant less than 3.9) in that such mayalleviate capacitive coupling between the vertically-spaced segments 28of the charge-trapping material 42. In such embodiments, the insulativematerial 32 may comprise porous silicon dioxide and/or silicon dioxidecontaining one or more of carbon, nitrogen and boron. In someembodiments, the insulative material 18 may consist essentially of, orconsist of silicon dioxide, and may have a higher dielectric constantthan the low-k material 32.

The charge-blocking material 40 extends vertically along the stack 12,is along the first and second ends 55 and 57, and lines the gaps 38. Thecharge-storage material 42 is within the lined gaps 38. In someembodiments, the charge-blocking material 40 may be considered to havean undulating vertical path which extends conformally along the firstand second ends 55 and 57.

The charge-tunneling material 44 and the channel material 46 may beconsidered to extend vertically along the stack 12, and to be adjacentthe levels 14 and 16 within such stack. In some embodiments, thecharge-tunneling material 44 may be considered to extend verticallyalong the stack 12, and to have a substantially planar vertical pathwhich extends along regions of the charge-blocking material 40, andalong the charge-storage material 42.

In operation, the charge-storage material 42 may be configured to storeinformation in the memory cells 66. The value (with the term “value”representing one bit or multiple bits) of information stored in anindividual memory cell may be based on the amount of charge (e.g., thenumber of electrons) stored in a charge-storage region of the memorycell. The amount of charge within an individual charge-storage regionmay be controlled (e.g., increased or decreased), at least in part,based on the value of voltage applied to an associated gate 64, and/orbased on the value of voltage applied to the channel material 46.

The tunneling material 44 forms tunneling regions of the memory cells66. Such tunneling regions may be configured to allow desired migration(e.g., transportation) of charge (e.g., electrons) between thecharge-storage material 42 and the channel material 46. The tunnelingregions may be configured (i.e., engineered) to achieve a selectedcriterion, such as, for example, but not limited to, an equivalent oxidethickness (EOT). The EOT quantifies the electrical properties of thetunneling regions (e.g., capacitance) in terms of a representativephysical thickness. For example, EOT may be defined as the thickness ofa theoretical silicon dioxide layer that would be required to have thesame capacitance density as a given dielectric, ignoring leakage currentand reliability considerations.

The charge-blocking material 40 is adjacent to the charge-storagematerial 42, and may provide a mechanism to block charge from flowingfrom the charge-storage material 42 to the associated gates 64.

The dielectric-barrier material 52 is provided between thecharge-blocking material 40 and the associated gates 64, and may beutilized to inhibit back-tunneling of charge carriers from the gates 64toward the charge-storage material 42. In some embodiments, thedielectric-barrier material 52 may be considered to formdielectric-barrier regions within the memory cells 66.

The assemblies and structures discussed above may be utilized withinintegrated circuits (with the term “integrated circuit” meaning anelectronic circuit supported by a semiconductor substrate); and may beincorporated into electronic systems. Such electronic systems may beused in, for example, memory modules, device drivers, power modules,communication modems, processor modules, and application-specificmodules, and may include multilayer, multichip modules. The electronicsystems may be any of a broad range of systems, such as, for example,cameras, wireless devices, displays, chip sets, set top boxes, games,lighting, vehicles, clocks, televisions, cell phones, personalcomputers, automobiles, industrial control systems, aircraft, etc.

Unless specified otherwise, the various materials, substances,compositions, etc. described herein may be formed with any suitablemethodologies, either now known or yet to be developed, including, forexample, atomic layer deposition (ALD), chemical vapor deposition (CVD),physical vapor deposition (PVD), etc.

The terms “dielectric” and “insulative” may be utilized to describematerials having insulative electrical properties. The terms areconsidered synonymous in this disclosure. The utilization of the term“dielectric” in some instances, and the term “insulative” (or“electrically insulative”) in other instances, may be to providelanguage variation within this disclosure to simplify antecedent basiswithin the claims that follow, and is not utilized to indicate anysignificant chemical or electrical differences.

The particular orientation of the various embodiments in the drawings isfor illustrative purposes only, and the embodiments may be rotatedrelative to the shown orientations in some applications. Thedescriptions provided herein, and the claims that follow, pertain to anystructures that have the described relationships between variousfeatures, regardless of whether the structures are in the particularorientation of the drawings, or are rotated relative to suchorientation.

The cross-sectional views of the accompanying illustrations only showfeatures within the planes of the cross-sections, and do not showmaterials behind the planes of the cross-sections, unless indicatedotherwise, in order to simplify the drawings.

When a structure is referred to above as being “on”, “adjacent” or“against” another structure, it can be directly on the other structureor intervening structures may also be present. In contrast, when astructure is referred to as being “directly on”, “directly adjacent” or“directly against” another structure, there are no interveningstructures present. The terms “directly under”, “directly over”, etc.,do not indicate direct physical contact (unless expressly statedotherwise), but instead indicate upright alignment.

Structures (e.g., layers, materials, etc.) may be referred to as“extending vertically” to indicate that the structures generally extendupwardly from an underlying base (e.g., substrate). Thevertically-extending structures may extend substantially orthogonallyrelative to an upper surface of the base, or not.

Some embodiments include a memory array which has a vertical stack ofalternating insulative levels and wordline levels. The wordline levelsinclude conductive wordline material which has first terminal ends. Theconductive wordline material is configured to include conductivewordlines along the wordline levels. The conductive wordlines arevertically spaced from one another by intervening regions of theinsulative levels. The insulative levels have second terminal ends. Thefirst terminal ends are laterally inset relative to the second terminalends such that gaps are along the first terminal ends and verticallybetween the second terminal ends. The insulative levels include firstinsulative material within the second terminal ends, and include secondinsulative material proximate the second terminal ends and within theintervening regions. The first insulative material has a differentdielectric constant than the second insulative material. Charge-blockingmaterial extends vertically along the stack, is adjacent to the firstand second terminal ends, and lines the gaps. Charge-storage material iswithin the lined gaps. The charge-storage material is configured asfirst segments which are arranged one atop another, and which arevertically spaced from one another by intervening second segments whichinclude the first insulative material within the second terminal ends.Charge-tunneling material is adjacent to the charge-storage material.Channel material extends vertically along the stack, and is adjacent tothe charge-tunneling material.

Some embodiments include a memory array having a vertical stack ofalternating insulative levels and wordline levels. The wordline levelshave control gate regions which include conductive terminal ends of thewordline levels. The control gate regions are vertically spaced from oneanother by first insulative regions which include first insulativematerial. Charge-storage material is laterally outward of the conductiveterminal ends. The charge-storage material is configured as segments.The segments of the charge-storage material are arranged one atopanother and are vertically spaced from one another by second insulativeregions which include second insulative material. The second insulativematerial has a lower dielectric constant than the first insulativematerial. Charge-tunneling material extends vertically along the stack,and is adjacent to the segments of the charge-trapping material. Channelmaterial extends vertically along the stack, and is adjacent to thecharge-tunneling material.

Some embodiments include a method of forming an integrated assembly. Avertical stack of alternating first and second levels is formed. Thefirst levels comprise first insulative material, and the second levelscomprise additional material. An opening is formed to extend through thefirst and second levels. A sacrificial material is formed within theopening and along the second levels selectively relative to the firstlevels. The sacrificial material is configured as first segments whichare vertically spaced from one another by first recesses. The firstinsulative material is exposed along inner lateral surfaces within thefirst recesses. Second insulative material is formed within the opening,along the sacrificial material and within the first recesses. The secondinsulative material directly contacts the first insulative materialalong the inner lateral surfaces. The second insulative material isremoved from along the sacrificial material while leaving the secondinsulative material remaining within the first recesses. The secondinsulative material remaining within the first recesses is configured assecond segments which are vertically spaced from one another byintervening regions. The sacrificial material is removed to form secondrecesses within the intervening regions. Charge-storage material isformed within the second recesses. Charge-tunneling material is formedadjacent the charge-storage material and extends vertically along thefirst and second levels. Channel material is formed adjacent thecharge-tunneling material and extends vertically along the first andsecond levels. The additional material of the second levels is removedto leave voids. Conductive material is formed within the voids.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1-48. (canceled)
 49. An integrated assembly, comprising: a verticalstack of alternating insulative levels and conductive wordlines; theconductive wordlines having terminal ends; a single layer ofcharge-blocking material extending along the stack; a charge-storagematerial comprising discrete segments adjacent the terminal ends of theconductive wordlines; a charge-tunneling material extending verticallyalong the stack; and a channel material extending vertically along thestack.
 50. The integrated assembly of claim 49 wherein the discretesegments of the charge-blocking material are vertically spaced from theinsulative levels by only the single layer of the charge-blockingmaterial.
 51. The integrated assembly of claim 49 wherein a verticaldimension of each discrete segment of the charge-blocking materialapproximates a vertical dimension of each conductive wordline.
 52. Theintegrated assembly of claim 49 further comprising a liner ofdielectric-barrier material surrounding each conductive wordline. 53.The integrated assembly of claim 49 wherein the conductive wordlinescomprise two separate conductive material structures.
 54. The integratedassembly of claim 49 wherein the insulative levels comprise two separateinsulative material structures.
 55. The integrated assembly of claim 54wherein one of the two separate insulative material structures comprisesa terminal end of each insulative level.
 56. The integrated assembly ofclaim 54 wherein one of the two separate insulative material structurescomprises a lower dielectric constant than the other one of the twoseparate insulative material structures.
 57. The integrated assembly ofclaim 54 wherein one of the two separate insulative material structurescomprises a more porous structure than the other one of the two separateinsulative material structures.
 58. The integrated assembly of claim 49wherein the charge-storage material comprises at least one of siliconoxynitride, conductive nanodots and floating gate material
 59. Theintegrated assembly of claim 49 wherein the charge-storage materialcomprises polycrystalline silicon.
 60. A method of forming an integratedassembly, comprising: forming a vertical stack of alternating insulativelevels and sacrificial levels, the sacrificial levels comprisingterminal ends configured as first recesses; forming an insulativematerial along the vertical stack and filling the first recesses;removing the insulative material along the sacrificial levels, theremoving forming second recesses at terminal ends of the sacrificiallevels; and forming charge-storage material within the second recessesleaving discrete segments adjacent the terminal ends of the sacrificiallevels.
 61. The method of claim 60 further comprising forming a singleliner of charge-blocking material between the charge-storage materialand the vertical stack.
 62. The method of claim 60 further comprisingreplacing material in the sacrificial levels with conductive materialafter the filling of the first recesses.
 63. The method of claim 60further comprising replacing material in the sacrificial levels withconductive material after the forming of the second recesses.
 64. Themethod of claim 60 further comprising replacing material in thesacrificial levels with conductive material after the forming of thecharge-storage material.
 65. The method of claim 60 further comprisingreplacing material in the sacrificial levels with two separatestructures of conductive material.
 66. The method of claim 60 furthercomprising forming charge-tunneling material along the vertical stack.67. The method of claim 60 further comprising forming channel materialalong the vertical stack.